PC LG Chem 1201‑22

Material Introduction: PC LG Chem 1201‑22 is a well‑balanced polycarbonate resin. It features good flowability, high transparency, favorable electrical insulation, high heat resistance and excellent impact resistance.

Main Applications

‑ Packaging Containers: Transparent packaging articles such as food utensils, bottle caps and disposable tableware. ‑ Electronic & Electrical: Certain components in the electronic‑electrical industry, e.g. appliance housings such as hair‑dryer housings. ‑ Toy Products: Manufacture of toys with balanced safety and durability. ‑ Others: General‑purpose injection‑molded or extruded articles requiring good transparency and heat resistance.

Physical Properties

Performance Category	Test Parameter	Test Standard	Typical Value / Range	Unit
Basic Characteristics	Density	ASTM D792	1.20	g/cm³
	MFR (300°C / 1.2 kg)	ASTM D1238	22	g/10 min
	Shrinkage ‑ Flow Direction	ASTM D955	0.50‑0.70	%
Mechanical Properties	Tensile Modulus	ASTM D638	2340	MPa
	Tensile Strength (Yield)	ASTM D638	60.0	MPa
	Tensile Strength (Break)	ASTM D638	66.0	MPa
	Elongation at Break	ASTM D638	120	%
	Flexural Modulus	ASTM D790	2410	MPa
	Flexural Strength	ASTM D790	96.0	MPa
Impact Properties	Izod Notched Impact Strength (23°C)	ASTM D256	750	J/m
	Dart Impact (23°C)	ASTM D3763	72.0	J
Thermal Properties	HDT (1.8 MPa, annealed)	ASTM D648	139	°C
	HDT (1.8 MPa, unannealed)	ASTM D648	126	°C
	Vicat Softening Temperature	ASTM D1525	147	°C
Optical Properties	Light Transmittance	ASTM D1003	89.0	%
	Haze	ASTM D1003	0.70‑1.5	%
Electrical Properties	Volume Resistivity	ASTM D257	2.0E+17	Ω·cm
	Dielectric Strength	ASTM D149	17	kV/mm
Flame‑Retardant Property	UL Rating (1.6 mm)	UL 94	V‑2	‑

Processing Parameters

Processing Technology	Key Parameter	Suggested Range / Description	Important Reminder
Injection Molding	Drying	Dry at 120 °C for 2‑4 hours; keep moisture content below 0.02 %.	Pre‑drying is mandatory! Even trace moisture will cause silver streaks, bubbles or deteriorated physical properties in finished parts.
	Barrel Temperature	Generally set within 270‑320 °C. For high‑flow grades such as 1201‑22, processing temperature may be appropriately lowered.	Too low temperature leads to poor plasticization; excessive temperature may cause material degradation.
	Mold Temperature	80‑100 °C.	Higher mold temperature reduces internal stress, improves melt flowability and delivers better surface gloss.
	Injection Speed	Relatively fast injection speed is commonly adopted.	Beneficial for mold filling; avoid excessive speed causing shear overheating or poor venting.
Extrusion Molding	Drying	Same as injection molding; sufficient drying is required.
	Processing Temperature	Adjust according to specific equipment and product geometry.	Extrusion generally requires higher molecular weight of resin (typically＞30 000).

Disclaimer: All above data is for reference only.